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Single-Wafer Polymer Removal for 0.18-micron to 0.25-micron Technology
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Published in EUROPEAN SEMICONDUCTOR, April 99 by Ernst Gaulhofer and H. Kruwinus, SEZ Austria; Gene Goebel, Eric Finson and Taishih Maw, EKC USA
Single wafer spin-processors are used with newly developed chemistries to fulfil the cleaning requirements of sub-quarter micron technology, especially when extended to 300 mm wafers ....
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