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Cost Reduction and Process Improvement by Integrated Detaping after Stress Relief on Ultra Thin Wafers
Thin Semiconductor Devices - Manufacturing and Applications, November 2002, Munich, Germany
Author: Werner Kröninger, Gerald Wagner, Urs Behrens
Abstract:
As the wafers' final thickness is decreasing, the handling of the wafers during and after the thinning process is becoming more and more difficult - especially the detaping of the backgrinding tape from the thinned wafer, where the risk of breakage and contamination of the backside is increased. The heat shrinkable tape, as developed by Mitsui Chemicals, offers a new way of easy detaping wafers with major advantages when combined with SEZ's Spin Processor technology. Based on the well proven Rinse-Dry-Module (RDM), the new detaper unit works with water only, thus eliminating mechanical force on the wafer during detaping.
Benefits:
- Reduced residue level due to integrated rinsing
- Reduced investment costs, footprint and CoO
- Integrated system with no additional handling step
- Reduced wafer breakage
The presentation will provide information about the RDM, heat-shrinkable tape and final evaluation.
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