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Benefits of Wet Chemical Spin-Processing for Ultra-Thin Wafer Applications
IEEE Symposium at the Electronica, November 2002, Berlin, Germany
Author: Gerald Wagner
Abstract:
As the wafers' final thickness is decreasing, several applications like in Smartcard manufacturing show a need for improved wafer and die stress performance, controlled surface conditions and solutions for thin wafer handling and metrology. Spin Processing by SEZ as an optimized method of wet etch stress relief has achieved the role of a market leader and technology driver within this field.
The presentation will inform about applications, stress and surface data, as well as equipment platforms.
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