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Cover Story - Single-wafer approach for 300mm
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Single-wafer approach for 300mm
With the increasing penetration of flip-chip technology into the 300 mm wafer-level packaging (WLP) market, requirements for process performance of solder bump technology have become more stringent. One of the biggest challenges for 300 mm WLP processing is the control of undercut and uniformity during etching of under-bump metal (UBM).
Lucy Chen, David Chen, Jackie Chen of SEZ Taiwan present the results of UBM etching for Ti/NiV/Cu, TiW/Cu, Ti/Cu based bumps using a single-wafer spin processor that can provide a solution for stringent undercut control.
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