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Single-Wafer Wet-Processing Technology Proves Extendible to Emerging Applications in the Advanced Packaging Arena
The demand for single-wafer wetprocessing technology has expanded beyond the fab floor to a variety of new applications for back-end semiconductor packaging and assembly, where the need for a more flexible, cost-effective and higher-performing wet solution is escalating rapidly. As a pioneer and leading provider of single-wafer wetprocessing solutions, SEZ has been instrumental in driving the transition to single-wafer technology in fab-line processes. Through its extensive experience in single-wafer technology development and integration, the company is ideally positioned to expand the available applications for its Spin Processor-based systems – the advancedpackaging arena is a prime example.
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