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High Uniformity Wet Processing for Oxide Thinning and Polymer Cleaning Applications
Ultra Clean Processing of Silicon Surfaces (UCPSS2002), September 2002, Oostende, Belgium
Authors: Gerald Wagner, Kei Kinoshita, Reinhard Sellmer, Stefan Fichtl
Abstract:
The requirements for high uniformity removal of silicon oxide have become more important due to different reasons. The paper shows how unmatched uniformities below 1% can be obtained by Spin Processing with DHF or BOE. An overview about the applications for high uniformity oxide etching is given, as well as a recommendation for media to be used.
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