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Single-Wafer Surface Conditioning - Improving Backside Metal Adhesion
BY SCOTT DREWS, SEZ America, Inc.
The need for back-side metal adhesion and solder contact for ultra-thin, discrete, high-power semiconductor devices has increased significantly over the past several years. To provide an optimized back-side metal adhesion contact to the silicon wafer’s surface, a tailored back-side surface is required for the specific silicon type, resistivity, and dopant level, as well as the metal or metal stack being deposited. This surface is critical so that the back-side metal layer does not crack or peel from the under-package stress and heat, and result in yield or performance loss.
Read full article on the Advanced Packaging website
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