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Semiconductor International - SEZ Takes Aim at FEOL Cleaning Challenges
SEZ Takes Aim at FEOL Cleaning Challenges
Pete Singer, Editor-in-Chief -- Semiconductor International
As the semiconductor industry moves to the 45 and 32 nm device generations, several new challenges must be overcome in front-end-of-line (FEOL) wafer cleaning and resist strip processes. These include problems with controlling particle removal, cross-contamination, damage, oxide removal, silicon and oxide loss, and watermarks. To address these challenges, a switch from the batch process equipment now commonly used to a single-wafer processing approach may be required.
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