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18-20-Sep-06: Presentations Involving SEZ at the Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS)
SEZ will be well represented at the 8th Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) in September in Belgium. The UCPSS is one of the premier conferences in the industry that focuses on surface preparation. SEZ will be authors on no less than five papers this year. We submitted three abstracts directly, two co-authored with customers (Samsung and STMicroelectronics), and one from our research center. Furthermore, we are indirectly co-authors on two other papers, one as part of our work with IMEC and one SEZ-sponsored student paper in conjunction with a major German university and Soitec.
It is with great satisfaction that all abstracts were selected for oral presentations. This is especially satisfying because of the extraordinarily high abstract submission rate this year and because of the quality of said abstracts. It is a great reflection on the work being done by SEZ engineers and scientists and the quality of our relationships with our customers and partners. Furthermore, it shows that SEZ is still a leader in the world of wet surface treatment for the semiconductor industry.
Should your travels take you to Belgium for the conference, we encourage you to experience what SEZ is really doing with our customers and our collaborators.
Following pls find an itinerary for the different talks to assist you in your planning.
Monday 13.45-14.00, Session 2: CLEANING AND DRYING FOR FEOL APPLICATIONS
Peracetic acid as active species in mixtures for selective etching of SiGe/Si layer systems
Guder M. , Kolbesen B.O. , Delattre C. , Fischer C. , Schier H.
Tuesday 08.45-09.00, Session 3: FEOL PHOTO RESIST REMOVAL
All-Wet Stripping of FEOL Photoresist Using Mixtures of Sulphuric Acid
Detterbeck S. , Bellandi E. , Alessandri M. , Henry S. , Archer L. , Hellweg T. , Kagerer
Tuesday 14.00-14.15, Session 6: REMOVAL and DAMAGE
Aging Phenomena in the Removal of Nano-particles from Si Wafers
Vereecke G. , Veltens J. , Xu K. , Eitoku A. , Arnauts S. , Kenis K. , Snow J. C. Vinckier , Mertens P.W.
Tuesday 15.00-15.15, Session 6: REMOVAL and DAMAGE
Study of a Single-Wafer in Metal Contact Hole Cleaning
Park J., Song J., Kim H., Cho H., Kim T., Moon B., Rho E., Archer L., Cho W.
Tuesday 15.45-16.00, Session 6: REMOVAL and DAMAGE
The Active Role of Etch Products in Particle Removal by SC-1 Solutions
Pfeuffer A. , Bensch W. , Lechner A. , Okorn-Schmidt H.
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