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Materials and Equipment Challenges for 32nm Development
3:00-3:20pm
| Challenges for 32nm CMOS Technology
IBM – Mukesh Khare | | 3:20-3:40pm | New Devices and Materials for 32nm and Beyond
University of Texas – Robert M. Wallace, PhD | | 3:40-4:00pm | CMP Challenges at 32nm
Intel – Mark Buehler | | 4:00-4:20pm | Wafer-Cleaning Challenges: Problems and Prospects
Formerly of Sony Corporation, Now with Hattori Consulting – Takeshi Hattori | | 4:20-4:40pm | EUVL – What is Needed to Take to Manufacturability
IBM / SEMATECH – Mike Lercel | | 4:40-5:00pm | Small Lot Manufacturing Rather Than 450mm
AMD – Dave Gross |
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