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SEZ Launches Dual-Use Da Vinci Prime Peter Singer, Editor-in-Chief -- Semiconductor International, 10/12/2007 7:31:00 AM SEZ Group (Villach, Austria) launched an upgraded version of the Da Vinci single-wafer wet cleaning tool at SEMICON Europa. Called Da Vinci Prime (DVP), the new tool is considered to have a “dual use” in that it can handle back-end-of-line (BEOL) applications more demanding than what the original Da Vinci (released in 2005) was designed for. It can also handle some of the less demanding front-end-of-line (FEOL) applications.
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The DVP employs some of the technology developed for SEZ’s most advanced tool, the Esanti, which was released late last year for FEOL cleaning applications, as well as resist stripping. Increasing device complexity and process requirements, such as those found in FEOL, requires more sophisticated equipment that can handle more types of chemicals, which may require separate lines for delivery, drain and exhaust, as well as for double-sided processing. Applications being targeted by the DVP tool include bevel cleaning, with something the company calls a bevel clean only (BCO) module, as well as high-k bevel clean, high-k wet etch, post-silicidation clean (to remove unreacted metals), diffusion/gate pre-clean and pre-silicidation/pre-metal clean. Leo Archer, vice president of emerging technology at SEZ, said the tool upgrade is designed to meet the needs of the 45 nm generation. SEZ introduced double-sided processing for the the Da Vinci platform in April 2006, an FEOL photoresist strip solution called Enhanced Sulfuric Acid (ESA) in July 2006 at SEMICON West, and the Esanti FEOL platform in late November.
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Esanti features a double-sided treatment capability, active-jet spray technology for enhanced defect removal, and SEZ’s proprietary atmospheric surface drying (ASD) technology, which prevents watermark formation and pattern collapse on a variety of structures during the drying process. DVP can also be equipped with active-jet technology for non-damage particle removal with DIW or DI + Media, ASD, double-sided processing, multi-chemical recirculation for improved cost of consumables, and low-RPM chucks for puddling and wafer soak applications. It is available in two configurations: one with a single front-end robot (max. throughput, 250 wph) or a dual front-end robot for “ideal” process (max. throughput, 350 wph).
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