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SEZ >  Press Room  >  SEZ in the News
SEZ in the News
19-Mar-08: Fabtech - Don't get excited: Despite Lam's acquisition of SEZ, little has changed...yet    
 
11-Dec-07: Semiconductor International - Lam to Acquire SEZ to Help Grow Clean Business   
 
15-Oct-07: SEZ launches Dual-Use DaVinci Prime   
 
11-Oct-07: Euro Asia Semiconductor - Facing Up To Change—SEZ Discusses Wet Clean For New Technology.   
 
28-Aug-07: Single-Wafer Surface Conditioning - Improving Backside Metal Adhesion   
 
18-Jul-07: Da Vinci platform received significant industry honor   
 
02-May-07: Study of a Single-Wafer Process in Metal Contact Hole Cleaning   
 
30-Apr-07: Key Challenges in Surface Preparation at 45 nm - Sponsored by SEZ   
 
19-Apr-07: All-Wet Stripping of FEOL Resist Using Mixtures of Sulphuric Acid   
 
27-Mar-07: SI Japan - 45 nm Wafer cleaning solution   
 
04-Jan-07: Semiconductor International - FEOL Process Challenges Drive Single-Wafer Transition at 65 nm and Below    
 
18-Dez-06: Advanced Packaging Roadshow - The SEZ Group   
 
14-Dez-06: Semiconductor International - SEZ Takes Aim at FEOL Cleaning Challenges    
 
28-Nov-06: MICROMagazine.com - SEZ hopes to make big splash with FEOL wet-cleaning tool    
 
28-Nov-06: The Semiconductor Reporter - SEZ introduces platform for FEOL single-wafer wet processing at 45 nm   
 
28-Nov-06: Semiconductor Fabtech - New Product: SEZ's 'Esanti' platform tackles 45nm volume production single wafer FEOL cleaning    
 
28-Nov-06: Euro Asia - SEZ announces next entry for FEOL   
 
18-20-Sep-06: UCPSS_2006   
 
13-Sep-06: EuroAsia_IC_Industry_Award_Winner_2006   
 
18-Jul-06: Audio Interview With Glenn Gale, SEZ   
 
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