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SEZ 323 Flexible Multi-Task Single Wafer Spin-Processor for 300 mm Wafer Surface Preparation Applications
The SEZ 323 is a new spin-processing system designed to meet next-generation requirements for high throughput cleaning and film removal applications for 300 mm semiconductor wafer processing.
A robot on a linear tracking system transports 300 mm wafers from four cassettes to two identical process chambers that can apply up to three chemicals each. The chemical cabinet for each chemical supplies both chambers. All other support systems are integrated in the main unit. Object-oriented software architecture (Windows NT platform) with a SEMATECH-compliant graphical user interface and touch screen simplify equipment operation.
Options like a retrofit kit (for processing 200 mm wafers), a rinse and dry module (RDM), endpoint detection (EPD), offline process editor, filter fan unit (FFU), extreme rapid dry (XRD), DI water-ozone processing, automated guided vehicle (AGV), frontside handling, electrostatic discharge dissipation, HF spiking for concentration control and a carrier ID reader ensure application solutions that meet and exceed customer needs.
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Selected List of Supported Applications:
Polymer Clean
Layer Etching
Layer Thinning & Etchback
Wafer Reclaim
Film Removal
Backside & Bevel Clean
Si Stress Relief
Wafer Manufacturing Applications
Si Thinning
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