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SEZ 223 Spin-Processor / Double-Chamber Processing System
The SEZ 223 represents a new spin-processing system designed to meet next-generation requirements for high throughput cleaning and film removal applications for semiconductor wafer processing.
A robot on a linear tracking system transports 200mm wafers from four cassettes to two identical process chambers with the capability of applying up to three chemicals each. One chemical cabinet for each chemical is supplying both chambers. The other support systems are integrated in the Main Unit. An object-oriented software architecture (Windows NT platform) with a Sematech compliant Graphical User Interface (GUI) and Touch Screen simplify equipment operation.
Options like Offline process editor, Mini-Environment, DIW-Ozone Processing, SMIF, AGV, Frontside handling, Film Removal End Point Detection, 125mm / 150mm Wafer Capability with change kit, ESD (electrostatic discharge) dissipation, HF Spiking for concentration control, Carrier ID reader ensure application solutions fulfilling and exceeding customer needs.
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Selected List of Supported Applications:
Polymer Clean
Layer Etching
Layer Thinning & Etchback
Wafer Reclaim
Film Removal
Backside & Bevel Clean
Si Stress Relief
Wafer Manufacturing Applications
Si Thinning
Compound Semiconductor Applications
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