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SEZ 203 Spin-Processor / Single Wafer Processing System
The SEZ 203 represents the current generation of SEZ's Spin-Processor.
The processor is configured to use up to three different chemical solutions in a programmable sequence for processing wafers in a single process cycle with an additional DI-water rinse and N2 dry.
All chemical solutions can be recycled, heated and filtered within the system or utilized in a single pass mode.
Options like Endpoint Detection System, ozone processing, contamination- free robot handling (Flip), thin-wafer handling (down to 70µm), and others ensure application solutions fulfilling and exceeding customer needs.
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Selected List of Supported Applications:
Polymer Clean
Layer Etching
Layer Thinning & Etchback
Wafer Reclaim
Film Removal
Backside & Bevel Clean
Si Stress Relief
Wafer Manufacturing Applications
Si Thinning
Compound Semiconductor Applications
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