05-07-Dec-2007, Booth: #5B-301, 10am - 5pm, Makuhari Messe, Japan
SEMICON Japan 2007 - SEZ focuses on the Da Vinci Prime We’ve recently launched the new Da Vinci PrimeTM (DVP), a flexible, dual-use (BEOL and FEOL) solution, which satisfies our aim to be the complete single-wafer, wet solutions provider. This launch completes our equipment portfolio—which comprises the traditional Da VinciTM series and the high-temperature, high-volume EsantiTM tool especially designed for photoresist stripping in FEOL—offering solutions that span BEOL and FEOL spectrum of applications. With this arsenal, we want to continue adding value to our customers, all the while maintaining our leading market position. SEZ launches Dual-Use Da Vinci Prime Facing Up To Change — SEZ Discusses Wet Clean For New Technology. Da Vinci platform received significant industry honor
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