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Cleaning ComplexitiesThe cleaning market still has a huge growth potential, and is one of the few growth areas left in the semiconductor industry. However, as appealing as it sounds, cleaning is a highly complex market that encompasses steps throughout the entire manufacturing process—FEOL, BEOL, and advanced packaging—and the number of cleaning steps continue to grow at an aggressive rate, each requiring different selectivity and defectivity requirements. This is further complicated by the stringent requirements of the ITRS roadmap for enhanced performance, and the introduction of new materials, particularly at 45 nm and below. Here’s a look at the cleaning complexities for each segment:
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