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SEZ >  Press Room  >  Press Releases
Press Releases
31-Jan-07: Major Korean Semiconductor Manufacturer Adopts SEZ's Da Vinci(TM) Tools for DRAM Manufacturing   
 
28-Nov-06: SEZ Deploys FEOL Cleaning Arsenal Featuring New Esanti Single-Wafer Wet Platform   
 
16-Oct-06: SEZ Group appoints industry veteran Yutaka Watanabe new Chief Operating Officer of SEZ Japan   
 
10-Jul-06: SEZ Introduces Novel Single-Wafer FEOL Photoresist-Removal Solution   
 
26-Jun-06: SEZ Gains Momentum in Asia-Pacific as Industry-Leading Chipmakers Place Multiple-System Orders for Da Vinci Tools   
 
04-Apr-06: SEZ Unleashes Double-Side Process Capability For Da Vinci Platform   
 
20-Mar-06: SEZ Shipping Multiple Single-Wafer Tools For Advanced Bumping Applications to Amkor Technology in Asia-Pacific   
 
20-Jan-06: SEZ's Glenn Gale speaks at the SPWCC Conference about Single-wafer FEOL Cleaning   
 
27-Sep-05: Soitec And SEZ Collaborate to Speed Industrialization of Strained SOI Substrates   
 
12-Jul-05: SEZ and Leading Semiconductor Manufacturer to Develop Advances FEOL Cleaning Solutions for Sub-65-nm Device Nodes   
 
11-Jul-05: Aviza Technology and SEZ Group Enter into Joint Development Agreement   
 
11-Jul-05: SEZ And Air Liquide Team to Develop Etch Solutions for Advanced Metal-Gate Materials   
 
27-Jun-05: SEZ Names International Industry Expert Glenn Gale Vice President of FEOL Cleaning Program   
 
12-Apr-05: Da Vinci? Platform Drives SEZ's Single-Wafer Business Model   
 
06-Apr-05: SEZ Supplies Single-Wafer Tools to Elpida for DRAM Manufacturing Capacity Expansion   
 
16-Mar-05: SEZ Sells First 300-mm Tool into China Market   
 
02-Mar-05: World-Leading Korean Manufacturer Places Multi-System Order for SEZ Da Vinci? Tools   
 
01-Dec-04: SEZ Increases Da Vinci? Sales Momentum in Japan, Expands Yokohama Demonstration Facility   
 
03-Nov-04: SEZ Secures First Korean 300-mm Production Tool Win    
 
12-Jul-04: SEZ Brings Benefits of Single-Wafer Spin Processing to Under-Bump Metal Etch for Semiconductor Advanced Packaging   
 
08-Jul-04: First production tool purchases mark milestone in rapid adoption of Da Vinci? Series by SEZ?s global customer base   
 
14-Apr-04: SEZ's Single-Wafer Processing Solutions Selected by UMCi   
 
19-Mar-04: SEZ Receives Major Order from DongbuAnam Semiconductor   
 
17-Mar-04: SEZ Announces Order From Major Chinese Foundry   
 
09-Feb-04: SEZ Completes Da Vinci?Series with Launch of Three News Wafer-Cleaning Tools   
 
03-Dec-03: SEZ Expands Single-Wafer Technology Beyond the Fab Line With New Galileo? Substrate-Etch   
 
04-Nov-03: SEZ Ships First Da Vinci? Single-Wafer Cleaning Tool to Major Taiwanese Semiconductor   
 
07-Oct-03: Sematech Awards SEZ's Efforts in 300-mm Automation and Process Control Management    
 
15-Sep-03: SEZ Secures Multimillion Dollar Order from Major Taiwanese DRAM Manufacturer   
 
03-Sep-03: AMD Awards SEZ Group with Supplier Award for Second Consecutive Year   
 
03-Jun-03: SEZ unveils world’s most productive system for single-wafer wet-process cleaning at the 90-nm technology node   
 
01-Apr-03: SEZ Predicts Single-Wafer Market to Outgrow Industry Forecasts   
 
12-Mar-03: SEZ Moves Forward with Single-Wafer Focused Strategy   
 
06-Mar-03: SEZ focuses on Single-Wafer-Technology   
 
04-Dec-02: International SEMATECH Qualifies Porous ULK Dual Damascene Process on 300 mm   
 
03-Dec-02: SEZ’s AeroSonic™ Drying Technology Promises Instant Productivity Gains   
 
26-Sep-02: AMD Honors SEZ With Spotlight Award   
 
10-Sep-02: APiA Gains Widespread Industry Acceptance   
 
05-Aug-02: Samsung Electronics Orders SEZ Spin-Processor for R&D   
 
29-Jul-02: Single-Wafer Leadership Basis for SEZ Market Share Growth in Cleaning Market   
 
17-Jul-02: SEZ Picks Up New Customer in Europe Targeting 300 mm Production   
 
25-Jun-02: New Sales Director David Fitzgerald Set to Expand U.S. Sales Base   
 
21-Jun-02: SEZ Receives VLSI Research 10 BEST Award in Customer Satisfaction Survey   
 
10-Jun-02: SEZ Acquires Critical Drying Technology   
 
04-Jun-02: New President and COO for SEZ Japan   
 
29-May-02: SEZ Sees Road to Recovery With Two Volume Orders   
 
30-Apr-02: SEZ America Launches US 300 mm Lab    
 
17-Apr-02: SEZ Meets Chip Industry Roadmap Challenges For Wet Surface Preparation    
 
17-Apr-02: 2002 European SEMI Award Presented to Franz Sumnitsch    
 
10-Apr-02: Economics, Performance and Environment: Keys to New IMEC/SEZ Cooperation Initiative    
 
26-Feb-02: SEZ Spins into SiLKnet Alliance to Aid Collaborative Low-k Process Development    
 
 

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