|
|
Spin-Processing Selected as Industry Mainstream for 300 mm Chip Making
The international SEZ Group (SWX: SEZN) has received multiple orders for its 300 mm Spin-Processors from a number of major chipmakers in Asia, Europe and the USA. The Spin-Processors will be used for surface preparation of 300 mm wafers, primarily to perform pre-lithography wafer backside cleaning, especially copper decontamination, and to recycle monitoring wafers (wafer reclaim).
The new Spin-Processor model for 300 mm applications, the 304, was launched at SEMICON Europa in Munich at the beginning of April. Within just a few weeks of its introduction, SEZ received confirmed orders for the 304 worth more than CHF 9 million [ca. USD 5.7 million]. With these new orders, SEZ is now represented in the vast majority of all current 300 mm pilot line projects worldwide. Delivery and installation of all systems is expected by the end of the year.
"SEZ was selected over larger competitors like Dainippon Screen Manufacturing Co. Ltd. and Tokyo Electron Ltd. because its Spin-Process technology meets the stringent processing requirements of 300 mm semiconductor production," said Michael Kucher, senior vice president for SEZ Group "SEZ has aggressively pursued 300 mm single-wafer product development in anticipation of the industry's transition to this technology. These orders are another indication that SEZ is leading the industry towards new manufacturing methods."
About SEZ
The SEZ Group is a leading supplier of spin-processing equipment to the global semiconductor manufacturing industry. The company's breakthrough proprietary Spin-Processor technology forms the basis of a broad portfolio of backside and frontside wafer surface conditioning products for semiconductor chipmakers worldwide. SEZ maintains development, manufacturing, sales, marketing and service operations in Europe, Asia and North America. Registered in Zurich, Switzerland, SEZ Holding AG is listed on the Swiss Exchange under the symbol (SWX: SEZN).
Villach, Austria, May 11, 2000
|