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International SEMATECH Takes Delivery of SEZ Spin-Processor for 300 mm R&D
VILLACH, Austria-December 03, 2001-The SEZ Group announced that International SEMATECH (ISMT) will take delivery of the 1300 SEZ Spin-Process tool for its 300 mm silicon wafer research and development. Based on previous success using SEZ tools for other frontside and backside applications, ISMT plans to use this tool to develop process modules for double-sided pre-oxidation and pre-gate cleanings.
The 1300 system is a single-wafer processing machine used for double-sided wafer treatment. It is designed to provide reliable, repeatable wafer processing simultaneously on both sides of the wafer. The tool is able to use up to two different chemicals in programmable sequences to process wafers in a single process cycle, with an additional DI water or ozonized DI water rinse and nitrogen dry. All of the chemicals can be drained or recycled within the system, reducing consumables and significantly lowering cost of ownership.
"Demand for SEZ's innovative single wafer process technology continues to be strong, especially with the adoption of 300 mm technology," commented Kurt Lackenbucher, chief marketing officer of the SEZ Group. "With the move to large wafer chip production anticipated to offer 25-35 percent cost savings as chipmakers increase substantially the number of die produced on these large wafers, it is encouraging to see R&D activities continuing in full force for cost-effective 300 mm cleaning processes."
In May, SEZ America implemented an R&D department in the U.S. to help develop new projects and products in close collaboration with its U.S.-based customers. The company created the department in response to the growing need of its U.S. customer base for strong, local development and engineering projects.
The 1300 tool is a smaller version of the SEZ Spin-Processor 8300. The 1300 has one process chamber, while the 8300 contains four process chambers. The 1300 is appropriate for ISMT's needs, given limited cleanroom space and modest volumes of wafers. Installation is scheduled for December 2001.
About SEZ
The SEZ Group is a leading supplier of wet wafer surface preparation equipment to the global semiconductor manufacturing industry. The company's breakthrough proprietary Spin-Processor technology forms the basis of a broad portfolio of single wafer backside and frontside wafer surface conditioning products for semiconductor chipmakers worldwide. Additionally, the company offers a complete range of wet bench equipment for batch processing. SEZ maintains development, manufacturing, sales, marketing and service operations in Europe, Asia and North America. Registered in Zurich, Switzerland, SEZ Holding AG is listed on the Swiss Exchange under the symbol (SWX: SEZN).
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