|
|
SEZ Unveils First Spin-Processor Compliant to SEMI Standards for 300 mm
The SEZ Group (SWX: SEZN) introduced its newest 300 mm platform for wafer cleaning and thinning applications, the Spin-Processor 304. The tool is SEZ's first Spin-Processor that is fully compliant with SEMI's 300 mm automation and communications standards.
"SEZ remains very active in developing and improving 300 mm process applications to support our Spin-Processing platforms," explained Michael Kucher, senior vice president for SEZ AG. "Customer interest in lower cost of ownership and easier factory integration drove the development efforts for the 304."
To ensure comprehensive factory automation interface functionality, SEZ has incorporated an object-oriented multi-tasking Windows® NT™ software platform into the 304. Computer hardware changes were also incorporated to improve the tool's performance. The 304 platform is the culmination of three years of development and testing at I300I, SELETE and SC300.
"The tool offers a direct replacement technology for batch wafer wet bench processing that allows greater process control with lower materials consumption," said Michael West, vice president of new business development for the SEZ Group. "Producing a tool that complies with SEMI standards was imperative to furthering our worldwide research and development activities."
The Spin-Processor 304 performs many applications, including backside film removal prior to advanced lithography operations and silicon stress relief for die strength enhancement in thinning operations. Additional processes offered include backside contamination removal of copper and metallic, organic and other particles, frontside film thinning for critical operations such as 50-angstrom gates, bevel cleaning and post-etch residue (polymer) removal.
About SEZ
The SEZ Group is a leading supplier of spin-processing equipment to the global semiconductor manufacturing industry. The company's breakthrough proprietary Spin-Processor technology forms the basis of a broad portfolio of backside and frontside wafer surface conditioning products for semiconductor chipmakers worldwide. SEZ maintains development, manufacturing, sales, marketing and service operations in Europe, Asia and North America. Registered in Zurich, Switzerland, SEZ Holding AG is listed on the Swiss Exchange under the symbol (SWX: SEZN).
Villach/Zurich, March 28, 2000
|