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SEZ Receives Multiple 300 mm System Order from New Customer
VILLACH, Austria-April 06, 2001-The SEZ Group (SWX: SEZN) announced that it has received an order from a major U.S. semiconductor manufacturer. This completely new customer has placed its first ever order with SEZ for Spin-Processing equipment. The company has ordered multiple Spin-Processor 304 systems, SEZ's 300 mm single wafer Spin-Processor for wafer surface conditioning applications. The value of the order is over $3.5 million.
The 304 is SEZ's 300 mm single-task multi-chemistry wet processing system with fully automatic handling for wafer surface preparation. The customer will use the 304 for the removal of backside contamination (copper, films, particles) in its 300 mm semiconductor wafer pilot line. These will be the first SEZ tools installed at the customer's facility and delivery is expected in the second quarter of this year.
"This order is indicative of the industry's move towards single wafer processing for critical applications within 300 mm semiconductor production," stated Michael Kucher senior vice president and member of the corporate executive board of the SEZ Group. "Next-generation device production will require highly advanced process control for specific applications. As a single wafer tool, the 304 can offer excellent process control with the lowest available materials consumption and low cost of ownership."
The Spin-Processor 304 performs many applications, including backside film removal prior to advanced lithography operations and silicon stress relief for die strength enhancement in thinning operations. Additional processes offered include backside contamination removal of copper and metallic, organic and other particles, frontside film thinning for critical operations such as 50-angstrom gates, bevel cleaning and post-etch residue (polymer) removal.
About SEZ
The SEZ Group is a leading supplier of wet wafer surface preparation equipment to the global semiconductor manufacturing industry. The company's breakthrough proprietary Spin-Processor technology forms the basis of a broad portfolio of single wafer backside and frontside wafer surface conditioning products for semiconductor chipmakers worldwide. Additionally, the company offers a complete range of wet bench equipment for batch processing. SEZ maintains development, manufacturing, sales, marketing and service operations in Europe, Asia and North America. Registered in Zurich, Switzerland, SEZ Holding AG is listed on the Swiss Exchange under the symbol (SWX: SEZN).
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