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SEZ Expands Semiconductor Wet Processing Portfolio with Acquisition of Wet Bench Supplier HMR
VILLACH, Austria-February 22, 2001-Semiconductor equipment producer, the SEZ Group (SWX: SEZN) reinforced its leadership in the $3 billion wet processing market by acquiring wet bench manufacturer HMReinraum-Technik Ltd. (HMR). With its recently launched double sided Spin-Processor 8200 and the addition of wet bench technology, the company can now offer its customers a broad spectrum of tools and applications for wet wafer surface preparation.
At the core of SEZ's business is its non-contact single wafer Spin-Process technology, which offers chipmakers excellent process control, uniformity and repeatability. The addition of HMR's technology enables the company to provide proven batch processing to its customers. HMR sells manual, semi-automatic and automatic wet bench systems. It has successfully developed leading edge wet bench technology and has experienced much success with major European chip manufacturers. The acquisition of this key technology will allow SEZ to meet all of its customer's wet processing needs and allow HMR the necessary resources and global capability to fully utilize its wet bench technology.
"SEZ's fundamental vision has been to become the market leader in wafer surface preparation for microchip production and this acquisition is one of several steps in fulfilling that goal," commented Herwig Petschnig, COO of the SEZ Group. "The wet processing market is currently highly fragmented and dominated primarily by suppliers of wet benches and spray etchers, but until now no supplier has been able to offer a complete solution for semiconductor wafer surface preparation. In an age of shrinking geometries, larger wafer sizes and increased automation this becomes pivotal to success and we are delighted to be in a position to capitalize on that advantage and in turn support our customer productivity and profitability objectives."
This year, SEZ plans to fully integrate HMR and develop wet benches for 300 mm semiconductor wafer manufacturing. A key part of the deal is to expand the capacity of HMR's existing manufacturing facilities in Donaueschingen, Germany. Additionally, SEZ plans to establish a competence center for wet bench technology at the same location. For the remainder of 2001, SEZ will concentrate on building and supporting HMR's European customer base. Starting in 2002, SEZ will market its wet bench products to chip manufacturers in the USA and Asia.
Based on its Spin-Process technology, the SEZ Group is the market leader for backside wafer treatment. The market for backside processing represents about 20 percent of the total wet wafer processing market. By incorporating HMR's wet bench manufacturing knowledge and capability, SEZ can now offer customers complementary wet processing applications outside of its traditional core market.
As a result of the takeover, the SEZ Group expects overall sales revenues to climb by CHF 30 million to CHF 290 million, with slightly decreasing profit margins for business year 2001. These estimates are based on the consolidation of HMR from January 01, 2001. Compared to previously published estimates, SEZ expects earning per share to grow by 4.6 percent to CHF 34.12.
About SEZ
The SEZ Group is a leading supplier of wet wafer surface preparation equipment to the global semiconductor manufacturing industry. The company's breakthrough proprietary Spin-Processor technology forms the basis of a broad portfolio of single wafer backside and frontside wafer surface conditioning products for semiconductor chipmakers worldwide. Additionally, the company offers a complete range of wet bench equipment for batch processing. SEZ maintains development, manufacturing, sales, marketing and service operations in Europe, Asia and North America. Registered in Zurich, Switzerland, SEZ Holding AG is listed on the Swiss Exchange under the symbol (SWX: SEZN).
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