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Semiconductor Applications Development Lab Using SEZ Spin-Processing to Develop Advanced Copper Applications
VILLACH, Austria, December 13, 2000 -- The SEZ Group (SWX: SEZN) announced that a semiconductor industry applications development center will use its Spin-Process equipment to perform copper decontamination and pre-lithography cleans for customers seeking to integrate copper and low-k into their devices. As a result of its participation, SEZ will have the opportunity to offer wafer decontamination and its accompanying yield improvement to companies that are developing their copper/low-k products.
"As the industry transitions to the larger wafer size and increased critical process steps, it is recognizing the need for single-wafer processing and wafer backside decontamination," explained Herwig Petschnig, chief operating officer of the SEZ Group. "In previous technology nodes the wafer backside did not have a significant impact on process yield and performance. However, as the industry moves into copper/low-k, the need to ensure the cleanliness of the wafer backside and overall wafer flatness becomes extremely important to ensure device yields."
SEZ's copper interconnect fabrication process knowledge will be used to develop and evaluate a complete copper damascene process flow. Characterization of the effects of copper contamination on all levels of the sub 180 nm device structures will be compiled for multiple customers.
SEZ was chosen to participate in these development efforts because of its extensive applications knowledge, field proven performance and demonstrated process capability. The company has placed a Spin-Processor 203, a 200 mm system, at the development lab and will deliver a Spin-Processor 304, 300 mm system, in December.
The Spin-Processor 203 and 304 models are configured to use up to three different chemical solutions in a programmable sequence for processing wafers in a single process cycle with an additional DI-water rinse and N2 dry. All chemical solutions can be recycled, heated and filtered within the system or utilized in a single pass mode. Options like endpoint control, ozone processing, contamination-free robot handling (Flip), thin-wafer handling (down to 70µm), and others ensure application solutions to meet customer needs. Applications include photolithography yield enhancement, back surface metal clean and film removal, copper contamination elimination, and wafer thinning and stress relief.
About SEZ
The SEZ Group is a leading supplier of spin-processing equipment to the global semiconductor manufacturing industry. The company's breakthrough proprietary Spin-Processor technology forms the basis of a broad portfolio of backside and frontside wafer surface conditioning products for semiconductor chipmakers worldwide. SEZ maintains development, manufacturing, sales, marketing and service operations in Europe, Asia and North America. Registered in Zurich, Switzerland, SEZ Holding AG is listed on the Swiss Exchange under the symbol (SWX: SEZN).
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