|
|
SEZ Increases Stepper and Scanner Yields With Innovative SpCE Process
PHOENIX, Arizona, February 29, 2000 - The SEZ Group (SWX: SEZN) and International SEMATECH reported that SEZ's spin-process contamination elimination (SpCE) process successfully eliminates the problem of back surface particles and foreign matter transferring from wafers to the lithography chuck. SEZ introduced the process at last year's SPIE exhibition.
"The SEZ SPCE process has demonstrated the capability to effectively eliminate copper cross-contamination in the dynamic semiconductor research and development environment at SEMATECH," said Patrick Lysaght, senior process engineer of International SEMATECH. "The versatility of the SPCE operation has resulted in its formal implementation as the standard pre-lithography clean process for all products."
The success of this process significantly reduces cleaning frequency and stepper and scanner down time. This is especially important in copper production lines where manufacturing costs are significantly reduced due to the virtual elimination of monitoring for copper cross-contamination.
"SEMATECH's findings support that we offer the industry an effective process to improve yields and reduce costs by eliminating most particle contamination before the critical lithography process step," explained Michael West, strategic business and technology director for SEZ. "These results demonstrate that our process solutions are effective in next-generation production technologies and with cutting-edge materials like copper and low-k dielectrics."
SpCE has successfully demonstrated normalization of wafer flatness as measured by whole wafer capacitance. This improvement in site focal plane deviation (SFPD) has been particularly beneficial to the process yield of novel low-k materials through the advanced DUV step and scan lithography tool, with reduced depth of focus (DOF), at SEMATECH.
About SEZ
The SEZ Group is a leading supplier of spin-processing equipment to the global semiconductor manufacturing industry. The company's breakthrough proprietary Spin- Processor technology forms the basis of a broad portfolio of backside and frontside wafer surface conditioning products for semiconductor chipmakers worldwide. SEZ maintains development, manufacturing, sales, marketing and service operations in Europe, Asia and North America. Registered in Zurich, Switzerland, SEZ Holding AG is listed on the Swiss Exchange under the symbol (SWX: SEZN).
|