|
Economics, Performance and Environment: Keys to New IMEC/SEZ Cooperation Initiative for Advanced Semiconductor Wafer Cleaning Solutions
VILLACH, Austria-May 29, 2002 - The strongest signal that the industry is on the upswing came for wet wafer surface preparation leader, the SEZ Group, (SWX: SEZN) with the receipt of two volume orders for its Spin-Processors within the last few weeks. The combined value of the orders is about CHF 22.2 million (USD 13.3 million). The orders are for tools for the treatment of 200 mm and 300 mm wafers and are expected for delivery in the business year 2002.
Singapore Foundry Orders Multiple Spin-Processors 223
One follow-on order came from a major foundry in Singapore for the Spin-Processor 223. The single-wafer tools for treatment of 200 mm wafers are among several SEZ Spin-Processors already installed in the Singapore foundry, the first being in 1997. The double-chamber 223 is designed especially for high throughput cleaning and film removal applications for wafer processing. According to executive vice president and chief marketing officer, Kurt Lackenbucher, these technology-driven orders are indication that chipmakers are starting to see an increase in demand, and equipment orders are on the rise.
US Microchip Manufacturer Orders Multiple Spin-Processors 304
One of the largest US integrated circuit (IC) manufacturers ordered Spin-Processors for the treatment of 300 mm wafers. The Spin-Processor 304 is SEZ's 300 mm single-wafer multi-chemistry wet processing system with fully automatic handling for wafer surface preparation. The tool is especially designed for the removal of backside contamination (copper, films, particles). The tools will be installed in the customer's 300 mm production line.
"With chip industry volatility creating a stronger requirement for cost reduction and productivity from equipment solutions, single-wafer technology continues to be process of choice for critical sub 0.13-micron manufacturing," stated Lackenbucher. "These repeat orders show customer confidence in SEZ, a spark of an industry turn around and more importantly realization of our single-wafer products as mainstream technology. Next-generation integrated circuits will increase in complexity putting enormous emphasis on requirements for cleaner manufacturing processes to meet rising productivity and performance needs. We are confident SEZ's single-wafer technology is addressing these needs." "This is especially true for 300 mm tools," stated Jim Mello, vice president of technical operations for SEZ America. "It is clear the industry is making a turn around with 300 mm in high demand, not to mention single-wafer technology as a key enabler for this transition."
About SEZ
The SEZ Group is a leading supplier of wet wafer surface preparation equipment to the global semiconductor manufacturing industry. The company's proprietary Spin-Processor technology (single wafer technology) as well as its wet bench equipment for batch processing forms the basis of a broad equipment solution portfolio for wafer cleaning and decontamination. SEZ maintains development, manufacturing, sales, marketing and service operations in Europe, Asia and North America. Registered in Zurich, Switzerland, SEZ Holding AG is listed on the Swiss Exchange under the symbol SEZN since 1996.
|