SEZ Introduces Novel Single-Wafer FEOL Photoresist-Removal Solution
Enhanced Sulfuric Acid™ (ESA™) Strip Process Optimized for Implementation with SEZ's New FEOL Single-Wafer Platform to Be Launched Later This Year
SEMICON WEST, San Francisco, Calif.—July 10, 2006—The SEZ Group (SWX: SEZN), the market leader and premier innovator in single-wafer, wet-processing solutions for the semiconductor industry, today announced it has developed a novel chemical process that will streamline front-end-of-line (FEOL) photoresist-strip processes. SEZ’s proprietary Enhanced Sulfuric Acid™ (ESA™) strip process can employ a range of sulfuric acid-based chemistries to greatly reduce the number of steps in photoresist-removal processes typically performed, until now, in an asher or in a batch environment: photoresist rework, post-etch and implant-resist removal, and residue removal following plasma ashing. While evaluations are ongoing at several key customer sites on a single-chamber R&D tool, this all-wet-chemistry approach is producing impressive results that are expected to increase when implemented on SEZ’s multi-chamber FEOL production tools for high-volume manufacturing, to be introduced later this year.
Photoresist-removal processes are time and cost-intensive, with up to 20 or more such steps required in FEOL. Stripping of implanted resist can occur 12 to 15 times, and performing the sequence repeatedly can lead to significant cumulative silicon loss that degrades transistor performance due to the oxidation of silicon under plasma ash conditions and subsequent removal of the oxide via wet clean. Chipmakers need cleaning processes that overcome these challenges—removing as little silicon as possible while reducing the number of overall steps required, while enabling faster process times and substantial cost savings. Working closely with key customers, SEZ leveraged its single-wafer expertise to develop a flexible, all-wet-chemistry approach that eliminates the need for plasma and removes defects at high temperatures. Single-wafer tools offer a number of advantages over batch tools in this regard: better defectivity control (less transfer of particles from wafer to wafer or from one side of a wafer to the other); better process control (improved uniformity and minimized substrate loss); and optimal usage of consumables (single-wafer tools can recirculate chemical media).
Kurt Lackenbucher, executive vice president and chief operating officer for the SEZ Group, noted, "As with all our technology, our solution for FEOL photoresist-removal applications is designed to meet customers' immediate, pressing needs, as well as creates a prime opportunity to implement a single-wafer approach in the FEOL space. The combination of the ESA strip process and our forthcoming FEOL platform will create a fast-throughput, high-performance solution that enables photoresist removal and residue clean-up in one flexible, single-wafer tool. This represents the next strategic step along our technology roadmap focused on anticipating customer needs to facilitate the deployment of single-wafer technology throughout the entire fab."
SEZ's ESA strip process employs the use of an enhanced sulfuric acid clean at temperatures up to 140°C. To date, the process has successfully removed both i-line and deep-ultraviolet (DUV) resists, as well as those containing a wide range of implant ions. Typical process times are extremely quick and produce low defectivity on both the front and backside of the wafer. Coupled with its ability to recirculate chemistry and low consumables consumption, these capabilities enable the ESA strip process to potentially deliver significant cost-of-ownership improvements.
SEZ has led the industry in driving the BEOL shift from batch to single-wafer processing and is now moving to effect a similar transition in the FEOL space, with emerging 65- and 45-nm geometries serving as the inflection point for this shift. The new FEOL approach delivers all of the key benefits associated with single-wafer wet technology: shorter cycle times, reduced defectivity, more economic use of process chemicals, minimal substrate damage, and expected improvements in overall cost of ownership. Building on its current foothold in the FEOL market in the area of backside clean applications, which represented almost 30 percent of SEZ's sales in 2005, the company sees significant growth opportunities with this new FEOL photoresist removal solution.
Further information regarding SEZ's new ESA strip process for photoresist removal, as well as its full portfolio of leading-edge single-wafer technology, will be available during SEMICON West 2006, July 11-13, at San Francisco's Moscone Center. Editors and analysts interested in learning more about the company and its products are invited to visit SEZ's booth #5368 located in the North Hall, or contact Karen Do by phone: +1-650-968-8900, x108, or email: kdo@mcapr.com.
About SEZ Group
The SEZ Group (Villach, Austria) is the leading provider of single-wafer, wet-processing solutions for the global semiconductor industry, with an installed base of over 1,000 tools. The company maintains operations in Asia-Pacific, Europe, Japan, and North America. SEZ Holding AG is traded on the SWX Swiss Exchange under the symbol SEZN. Additional information about the company is available on the Internet at www.sez.com
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