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SEZ Brings Benefits of Single-Wafer Spin Processing to Under-Bump Metal Etch for Semiconductor Advanced Packaging
First Back-end Customer Will Deploy SEZ's Single-Wafer Wet-Processing Technology for Solder Bump Application
VILLACH, Austria, and ZURICH, Switzerland, July 12, 2004?Marking the latest milestone in its efforts to expand its market-leading single-wafer wet processing technology throughout the entire IC manufacturing process, the SEZ Group (SWX: SEZN) today announced it has entered the back-end under-bump metallization (UBM) etch market. SEZ's pioneer UBM etch customer is a Taiwan-based world leader in semiconductor packaging and test, and a primary provider of solder bumping, as well as ball grid array (BGA) and flip-chip packaging. The company will shortly take delivery of multiple SEZ tools for UBM etch process qualification.
Serving as the foundation upon which solder bumps are created, UBM is typically formed through deposition of multiple layers of different, compatible metals. Once the layers are created, a thick photoresist is applied, followed by electroplating and photoresist strip; the UBM serves as the electrode for the plating process. Finally, just prior to reflow and completion of the bump, the excess metal is etched away?a step that has typically been performed primarily by batch spray tools. However, batch tools can no longer achieve the undercut and uniformity performance required for UBM etch, particularly on 300-mm wafers. SEZ's proven single-wafer wet technology is ideally suited to meet the stringent requirements of such advanced technologies.
Kurt Lackenbucher, SEZ's executive vice president, noted, "Our entry into the UBM etch market actually represents SEZ's second successful venture within the advanced packaging sector. The first was the introduction last year of our proven substrate-etch technology, delivering wafer thinning, surface conditioning and stress relief to enable higher-performing IC packages. Preceding substrate etch in the manufacturing process, UBM etch represents another critical piece of the single-wafer wet processing puzzle. We are pleased to be working with a recognized industry leader to deliver our first UBM etch single-wafer solution. Moreover, by optimizing for new applications tools already proven in front-end mass production, we are expanding both the flexibility and the cost-effectiveness of our single-wafer wet technology solutions without having to develop new hardware."
Market Opportunity
The overall market for bumping and advanced packaging equipment is growing at a rapid pace. An SEZ market survey estimates that these tools, having accounted for 8 percent of total IC equipment sales in 2003, will represent 16 to 18 percent (or .5 billion) of the overall equipment industry by 2010. Companies seeking single-wafer solutions for UBM etch are expected to include full-service packaging and test houses, as well as smaller, pure-play bump providers. SEZ's multi-chamber single-wafer wet technology offers these companies significant advantages for 300-mm printing and plating solder bump applications, as well as seed layer etching for redistribution layers (RDL).
About SEZ Group
SEZ Group is the leading provider of single-wafer, wet-processing solutions for the global semiconductor industry, with an installed base of over 800 tools. The company maintains operations in Asia-Pacific, Europe, Japan, and North America. SEZ Holding AG is traded on the SWX Swiss Exchange under the symbol SEZN. Additional information about the company is available on the Internet at www.sez.com
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