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SEZ Receives Major Order from DongbuAnam Semiconductor
Foundries Continue to Leverage SEZ's Single-Wafer Technology in Tackling Cleaning and Film Removal Challenges Associated with Next-generation Device Production
VILLACH, Austria and ZURICH, Switzerland, March 19, 2004?The SEZ Group (SWX: SEZN), the market leader and premier innovator in single-wafer wet-processing technology for the semiconductor industry, today announced it has received a follow-on order from one of the world's leading pure-play wafer foundries, DongbuAnam Semiconductor (Seoul, South Korea). The order is for several of SEZ's 223 single-wafer Spin Processors amounting to over US $10 million. Slated for installation at DongbuAnam's Sangwoo, South Korea fab in the second and third quarters of 2004, these tools will be deployed for backside cleaning and polymer/film removal in the manufacture of CMOS devices with 0.18- and 0.13-micron design rules.
Mr. Lee Jeong, senior executive vice president of DongbuAnam's Manufacturing Division, noted, "Our world-class CMOS wafer processing operations require us to partner with only the top suppliers that can help ensure our fabs continuously run at benchmark levels. SEZ has provided the high-quality and reliable products, as well as the localized support needed to meet our processing standards?at a low cost of ownership."
According Egon Putzi, chief executive officer of the SEZ Group, "SEZ continues to dominate the single-wafer wet processing segment?holding more than 80-percent market share in Korea alone. With shrinking device geometries and the utilization of new materials, such as copper, foundries and chipmakers, alike, cannot afford the costly risk of cross contamination during critical cleans and subsequent yield loss. Due to its superior performance and high-throughput advantages, we're continuing to see our single-wafer wet processing technology beat out multiple-wafer platforms for advanced cleaning and film removal applications?as further evidenced by this follow-on order from DongbuAnam."
SEZ's 223 Spin Processor is designed to meet next-generation requirements for high-throughput cleaning and film/polymer removal applications. A robot on a linear tracking system transports 200-mm wafers from four cassettes to two identical process chambers with the capability of applying up to three chemicals each. One chemical cabinet for each chemical supplies both chambers. The 223 also features an object-oriented software architecture (Windows NT platform), along with an International SEMATECH-compliant graphical user interface (GUI) and touch screen, to allow for simplified equipment operation. Other key benefits of SEZ's spin-processing technology include excellent uniformity, high selectivity, strong process repeatability and flexibility.
About DongbuAnam Semiconductor
DongbuAnam Semiconductor, the world's fourth largest pure-play wafer foundry, specializes in world-class CMOS wafer processing that enables system-on-a-chip implementations that integrate the most advanced logic, analog, and mixed-signal technologies. Through close working relationships with strategic partners, DongbuAnam offers a broad range of services that augment its world-class wafer manufacturing capabilities. These include advanced design support, access to a wide variety of intellectual property and prototyping, as well as backend assembly, packaging and testing. DongbuAnam is a key global supplier within Korea's well-established semiconductor manufacturing infrastructure. For more information, visit www.dsemi.com
About SEZ Group
SEZ Group is the leading provider of single-wafer, wet-processing solutions for the global semiconductor industry, with an installed base of over 750 tools. The company maintains operations in Asia-Pacific, Europe, Japan and North America. SEZ Holding AG is traded on the SWX Swiss Exchange under the symbol SEZN. Additional information about the company is available on the Internet at www.sez.com.
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