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SEZ unveils world’s most productive system for single-wafer wet-process cleaning at the 90-nm technology node
Growing Asian Market Slated to Receive First Commercial Delivery of New "Da Vinci" Wafer-Cleaning Series in Q3 2003
VILLACH, Austria, and ZURICH, Switzerland, June 3, 2003-The SEZ Group (SWX: SEZN), the market leader and premier innovator in single-wafer cleaning technology for the semiconductor industry, today unveiled a breakthrough in wet-surface-preparation spin processing. The innovative, new "Da Vinci" series unites high throughput and small footprint to provide the greatest level of serviceability and reliability possible in a single-wafer approach. Its modular, multi-chamber design delivers SEZ’s proven process capabilities to significantly reduce cost of ownership (CoO) and meet the high-volume manufacturing needs of customers worldwide. Featuring a "best-of-breed" combination of both production-proven and newly integrated SEZ technologies, the Da Vinci series is designed to help speed the industry’s transition from batch processing to single-wafer cleaning technology.
Manufacturers increasingly demand sophisticated back-end-of-line (BEOL) polymer cleaning capabilities that will not complicate or slow down production lines-this will become an even higher priority as the imminent upturn progresses. The first product in the Da Vinci series, the eight-chamber DV-38F, specifically targets BEOL processing of 300-mm wafers with 90-nm and below geometries. SEZ reports that first commercial shipments of the DV-38F will go to the growing Asian market, where the system is needed to replace competitive tools that cannot deliver the reliability these customers demand. Deliveries are slated to commence in the third quarter of 2003.
SEZ estimates that single-wafer systems currently address up to 40 percent of the available market for BEOL cleaning, a key component of the wet surface-preparation sector. However, shrinking semiconductor design rules and new materials like copper and low-k dielectrics-together with their stringent processing requirements-are driving an increase in demand for single-wafer solutions. This is particularly true for volume chipmakers and foundries producing high-aspect-ratio geometries at the 90-nm and smaller technology nodes, since batch technologies cannot effectively clean high-aspect-ratio structures as well as single-wafer systems can. In addition to its superior ability to meet the cleaning requirements for advanced manufacturing, single-wafer cleaning technology also enables faster cycle times and an increased flexibility in lot scheduling, reducing work in progress.
SEZ Executive Vice President Jim Mello noted, "In developing the Da Vinci series, we worked closely with our customers to ensure that we would meet their most advanced technology and time-to-market requirements. As customers continue to delve into 90-nm geometries and below, they’re looking for greater efficiency and yield-cost savings than ever before. Not only do they need high-performance, high-volume processing solutions to remove etch residues when fabricating advanced devices, but they also require an upgrade path for future technology and process improvements. The Da Vinci series was designed to deliver all this, and more."
Key Features and Benefits
The Da Vinci series is based on an innovative, new design. Its footprint, reduced by more than 75 percent over that of previous offerings, is the smallest that can be achieved in a single-wafer system while still delivering full serviceability and maintainability. Combined with the system’s high reliability and high throughput (which approaches the threshold of batch-processing capability), these features make installing multiple Da Vinci systems on the manufacturing floor highly space- and cost-efficient.
Automated capabilities are also integrated into the Da Vinci series. Its robotic handler ensures optimal system uptime, enabling throughput numbers in the range of 200 wafers per hour and beyond. New process controls enable full control and monitoring of all processing parameters, including flow rate, chemistry temperature and speed of chemical expansion. Front and rear user interfaces allow two users to interact with the system and provide updated input in real time.
The DV-38F can perform BEOL polymer removal on the front side of up to eight 300-mm wafers simultaneously. The Da Vinci-based DV-38F’s spin-processors are optimized with advanced process controls, an enhanced software system, an onboard chemistry dispensing system, proven wafer handling and an easy-to-use operator interface-providing a unique design in wafer-cleaning innovation. To further facilitate adoption into production lines, the system lets customers select their preferred organic or inorganic process chemistries, rather than having to employ specific chemistries, as with other tools. Moreover, the system’s flexibility enables continuous production during maintenance in the process section, resulting in higher uptimes. The DV-38F is currently available for demonstrations and product orders.
About SEZ Group
SEZ Group is the leading provider of single-wafer, wet-clean processing solutions for the global semiconductor industry, with an installed base of over 700 tools representing nearly 1000 process chambers. The company maintains operations in Asia, Europe and North America. SEZ Holding AG is traded on the Swiss Exchange under the symbol SEZN. Additional information about the company is available on the Internet at www.sez.com
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