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Economics, Performance and Environment: Keys to New IMEC/SEZ Cooperation Initiative for Advanced Semiconductor Wafer Cleaning Solutions
VILLACH, Austria, April 10, 2002 - Semiconductor surface preparation leading supplier, the SEZ Group, and Europe's leading semiconductor R&D center, IMEC, today announced a cooperation initiative to develop economically viable, performance enhanced and environmental friendly semiconductor wafer preparation solutions for future generations of IC manufacturing.
As part of the two-year joint development project, SEZ shipped two systems to IMEC for cleaning evaluation and testing. SEZ's Spin Processor 203 will be used for i) Backside film removal for pre-litho yield enhancement ii) Backside and bevel clean, such as copper (Cu) decontamination iii) Frontside polymer clean for metal line, via holes and Cu dual damascene technologies. IMEC and SEZ will study and develop backside and bevel cleaning processes for novel high-k materials. Also backside and bevel cleaning of Ti/TiN and other metals as a replacement for poly gate will be investigated.
SEZ's Spin Processor 1200, a double-sided single wafer tool, will be used at IMEC to study applications in front end of line (FEOL) critical pre-cleans, specifically for gates. IMEC and SEZ plan to research different drying methods and alternative cleaning techniques, which focus on chelating agents and the use of different Megasonic systems.
``Next-generation processes require new environmental friendly and economically viable cleaning processes with increased particle removal efficiency for ultra-small particles,'' explained Luc Van den hove, vice president silicon process technology division of IMEC. ``We have worked on cleaning technologies and ultra-clean processing since 1989 and have invested a considerable amount of man-years in this field. Cleaning is one of the key elements in the contamination control that allows the introduction of novel materials in a CMOS prototyping line. With SEZ's technological capability and support in this field, we believe we can enable the industry to better meet next-generation IC manufacturing requirements.''
``Low consumables consumption, short treatment times and single wafer processing offers customers many advantages over conventional cleaning technologies with an extremely low cost of ownership,'' commented Kurt Lackenbucher, senior vice president and chief marketing officer of SEZ. ``We believe our Spin-Processing technology is a good candidate for future technology developments for production at 0.13 micron and below. As a single- wafer tool, the Spin-Processor 1200 offers a suitable wafer-to-wafer repeatability for cleaning applications and the 203 can provide advanced chemistry sequences (reduction in consumables) that will greatly reduce process times for polymer removal and backside etch and cleaning applications. This results in higher throughput and lower cost of ownership for the customer.''
The collaboration will emphasize bridging the gap between the fundamental understanding and the actual strategy and application of appropriate cleaning processes, with consideration being given to environmental health and safety and overall economics. IMEC has acquired a unique know-how in CMOS technology, which will be further developed to combat the challenges in the continued scaling (below 0.1 micron) of CMOS. IMEC will also apply its expertise in process integration and focus on key issues like cycle time reduction, yield and reliability improvements. To support the joint development project, SEZ will provide an on-site process engineer at IMEC for two years.
About IMEC
IMEC was founded in 1984 and today is Europe's largest independent research center in the field of microelectronics, nanotechnology, enabling design methods and technologies for ICT (Information and Communication Technology) systems. IMEC's activities concentrate on the design technology for integrated information and communication systems; silicon process technology; silicon technology and device integration; nanotechnology, microsystems, components and packaging; solar cells; and advanced training in microelectronics. IMEC is headquartered in Leuven, Belgium, and has a staff of more than 1200 people including over 350 industrial residents and guest researchers. IMEC has a 0.13um 200mm pilot line and is ISO9001 certified. Its revenue of more than 120 Million Euro is derived from agreements and contracts with the Flemish government and companies, the EC, MEDEA+, the European Space Agency, equipment and material suppliers and semiconductor and system-oriented companies worldwide. News from IMEC is located at www.imec.be.
About SEZ
The SEZ Group is a leading supplier of spin-processing equipment to the global semiconductor manufacturing industry. The company's
breakthrough proprietary Spin-Processor technology forms the basis of a broad portfolio of backside and frontside wafer surface
conditioning products for semiconductor chipmakers worldwide. SEZ maintains development, manufacturing, sales, marketing and service
operations in Europe, Asia and North America. Registered in Zurich, Switzerland, SEZ Holding AG is listed on the Swiss Exchange under the
symbol (SWX: SEZN). SEZ also can be found on the world wide web at www.sez.com..
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