|
|
Released by APiA
The Advanced Packaging and Interconnect Alliance Gains Widespread Industry Acceptance with Significant Membership Growth
Amkor Technology Joins the APiA Advisory Board in Addressing the Industry's Specific Equipment and Material Performance Needs
Minneapolis, September 10, 2002 - The Advanced Packaging and Interconnect Alliance (APiA), a global group of leading semiconductor equipment, material and process technology suppliers, today introduced six new members to the growing ranks of the APiA. In addition, Amkor Technology, Inc. became the newest member to join the APiA's Advisory Board, which provides structured input to aid alliance members in addressing the industry's specific equipment and material performance needs. The new members and their contributions are:
Amkor Technology – Wafer processing, package design assembly and testing
Clariant AZÔ – Photoresist and electronic materials
Dage – Bump shear testing and X-ray inspection
Dow Corning – Materials for die attach, encapsulation, redistribution, and thermal management
FSI International – Bulk photoresist, under bump metal & flux strip, and oxide removal
SEZ Group – Metal etch, silicon etch, and bond pad descum
The APiA welcomes the additional members from a wide variety of equipment and materials disciplines. The additions emphasize the APiA's commitment to providing the most complete solutions for both plated and printed bumping technologies. The APiA has chosen not to focus on one process solution (plated or printed) but rather to support the advanced packaging industry by offering comprehensive solutions tailored to individual company requirements. Because of this comprehensive solutions concept, the APiA has gained significant industry acceptance, experiencing a 300% growth in membership since the December 2001 inception.
The APiA added Amkor Technology to the growing group of Advisory Board members. The APiA's Advisory Board provides a forum for process developers, designers and manufacturers that are committed to developing the necessary infrastructure to enable industry-wide access to advanced packaging and interconnect technologies. Membership in the APiA Advisory Board unites organizations with an interest in the advanced packaging and interconnect industries. I/C designers, device manufacturers, semiconductor assembly and test service providers (SATS), contract manufacturing service providers (CMS), and end product design companies are invited to apply for Advisory Board membership.
Commenting on the Advisory Board's contribution to the alliance, Ellery Buchanan, the APiA's chairman, stated, "The Advisory Board's purpose is to provide efficient and effective communication with equipment, material, support and process technology companies. The Board, in collaboration with the general APiA membership, intends to address the escalating manufacturing and performance challenges of leading edge chipmakers to ensure timely access to the necessary process and equipment infrastructure." The APiA Advisory Board is establishing a roadmap that it believes identifies the technology challenges and needs facing the Advanced Packaging industry over the next 10 years.
The APiA will host another in its series of educational seminars on September 16 during SEMICON Taiwan. The event will be held at the Grand Ballroom II at the Grand Hyatt Hotel in Taipei, Taiwan and will include speakers from Chipbond, ASE, TSMC and others. For details contact Stephen Kay at
skay@corp.ultratech.com, or register online at
www.apialliance.com.
Forward-Looking Statements: This release contains forward-looking statements that involve risks and uncertainties including statements regarding the Advanced Interconnect and Packaging Alliance (APiA) and without limitation, information regarding interconnect technology solutions resulting from the APiA, the future success of the APiA's product and process developments and standards, the APiA members' long-term plans to collaborate on accelerating the commercial availability of APiA-developed products, and the ability of certain of the APiA members to support the APiA. These forward-looking statements involve risks and uncertainties that may cause actual results to differ from those set forth in the forward-looking statements, including but not limited to the rapid pace of technological change in the semiconductor industry, strategic decisions and ability to implement by APiA and its members, or any unforeseen difficulties in the development and acceptance of the APiA's products or processes, or in the economy in general.
About APiA: The APiA is focused on accelerating the development and implementation of commercially viable, comprehensive and risk-free packaging solutions that address the escalating manufacturing and performance challenges of leading-edge chipmakers worldwide. Executive members of the APiA are: August Technology (Nasdaq: AUGT); EBARA Corporation; Ultratech Stepper (Nasdaq: UTEK); Unaxis Balzers Ltd. The APiA home page on the World Wide Web is located at www.apialliance.com..
APiA Contact:
Steven Kay, APiA Chairman of Promotion Committee
Tel: 408-325-6067
Fax: 408/325-6444
Email: skay@corp.ultratech.com
|