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Samsung Electronics Orders SEZ Spin-Processor for R&D
VILLACH, Austria, August 5, 2002 - Wet wafer surface preparation leader, the SEZ Group, (SWX: SEZN) announced that Samsung Electronics Co., Ltd., the leading Korean chipmaker, has ordered a double-chamber spin processor 223 to be used in its research and development line. The 8-inch single-wafer tool will be used for backside clean and bevel undercut etch.
"This order is of great strategic importance for SEZ, establishing a close relationship with one of the world's top IC makers," commented Kurt Lackenbucher, SEZ's chief marketing officer. "It highlights SEZ's leadership in single wafer advanced technology bevel undercut applications. The bevel undercut capability is unique to SEZ spin-processors and is becoming a necessity especially for copper and low-k applications where contamination issues are most critical."
The double-chamber Spin-Processor 223 is designed especially for high throughput cleaning and film removal applications for semiconductor wafer processing. A robot on a linear tracking system transports 200 mm wafers from four cassettes to two identical process chambers with the capability of applying up to three chemicals each.
Shipment is scheduled for second half of this year.
About SEZ
The SEZ Group is a leading supplier of wet wafer surface preparation equipment to the global semiconductor manufacturing industry. The company's breakthrough proprietary Spin-Processor technology forms the basis of a broad portfolio of single wafer backside and frontside wafer surface conditioning products for semiconductor chipmakers worldwide. Additionally, the company offers a complete range of wet bench equipment for batch processing. SEZ maintains development, manufacturing, sales, marketing and service operations in Europe, Asia and North America. Registered in Zurich, Switzerland, SEZ Holding AG is listed on the Swiss Exchange under the symbol (SWX: SEZN). SEZ also can be found on the World Wide Web at www.sez.com.
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