The Spin Processor

SEZ’s spin-processing architecture, shown in Figure 1, comprises a process chamber, a patented wafer chuck (or wafer-holding device) and a medium-dispensing arm. The combination of the wafer chuck, process chamber with its vertically arranged process levels, and fully automatic wafer transport system offers unrivaled process results. During the process, the wafer is placed on the chuck with the side to be processed facing upward and floating above the rotating chuck without touching it. A nitrogen cushion protects the side facing the chuck throughout the entire treatment process, eliminating several of the pre- and post-process steps traditionally needed to protect the wafer.

The media-dispensing arm applies the etch mixtures to the wafer. Due to the high-rotation speed of the chuck, the acid is distributed evenly on the wafer, then spins off and collects in the drip ring of the corresponding process level, to be recycled for continued processing, or drained. At the end of the treatment process, the wafer is rinsed and dried in the highest process level. On top of all this, SEZ’s spin processing technology reduces the consumption of resources (chemicals and deionized water)—thereby adding to its CoO advantages.

Other key benefits of SEZ’s spin-processing technology include:

• Excellent uniformity
• High selectivity
• Unmatched process repeatability
• Significant impact on overall single process cycle
• Independent chemical lines for high process flexibility
• Adaptability to serve customers’ unique requirements
• Low particle defect density due to low particle counts and watermark prevention