Presentations from Intel and AMD at the SEZ sponsored SEMI TechXPOT at SEMICON West 2007 are referenced in article.

Article Summary:

Semiconductor device technology will continue to evolve for the foreseeable future despite the many challenges that lie ahead. Much of what has in the past been considered to be roadblocks will continue and intensify. The industry is changing as it matures, and the hurdles to new technology adoption are now more complex. There is a delicate interplay of financial, business, and technical challenges that seriously affect the rate and effectiveness at which advanced technology nodes become accepted. The effects impact both customer and supplier alike and only a synergy between both groups will assure success. For wet cleaning there will be a plethora of old and new issues to be concerned about.

Things that were minor annoyances before may become major roadblocks in the near future as the sensitivities of new device structures and materials require more intricate solutions. One thing is clear – single-wafer processing will play a critical role in the manufacturing model of the future. In the area of wet cleans, it will be the companies who have the best understanding of the challenges combined with the most experience in developing and implementing the solutions that will excel and survive.

SEZ, with its award winning tools and industry-leading experience, will be one of those critical companies and partners that will rise to address the challenges that lie ahead and, ultimately, will play a key role in the continued adoption of new technologies.