SEZ’s new platform—EsantiTM—is a flexible, multi-chamber, single-wafer wet processing platform designed to address front-end-of-line (FEOL) cleans for emerging technology nodes. As increasing stringent specifications for FEOL cleans pose limitations to this wet-bench dominant arena, Esanti introduces a single-wafer approach which meets these requirements with significantly higher performance advantages for high-volume manufacturing.

Built upon SEZ’s proven Spin Processor technology, Esanti is an evolutionary platform that incorporates validated single-wafer capabilities previously integrated into the industry-leading Da VinciTM Series, while introducing new features for enhanced FEOL clean processing. These new features—double-sided cleaning, high-temperature processing (up to 140°C), Active Jet spray and Atmospheric Surface Drying—enhance defect removal and surface drying to effectively address a wide range of FEOL high-volume manufacturing applications. Target FEOL applications for Esanti include: pre-diffusion cleans, pre-gate cleans, contact and pre-metal deposition cleans, post-strip/ash cleans, dilute hydrofluoric acid (dHF)-last processing, post-implant wet resist stripping and cleaning, and photoresist rework.

With throughputs on par with wet benches, Esanti reduces defects caused by watermarks on the wafer surface, ultimately improving device performance and yield. When these features are coupled with the platform’s ability to recirculate and consume less chemistry than traditional FEOL cleaning technologies, Esanti provides the potential to deliver significant cost-of-ownership (CoO) improvements.

Key Benefits

• High-temperature (140°C) processing (ESATM)
• Active Jet technology
• Atmospheric Surface Drying
• Utilizes up to 4 different chemical media
• Smallest footprint available in a single-wafer processing system
• Throughputs on par with wet benches