An evolutionary successor to SEZ’s flagship Da Vinci platform, the new Da Vinci Prime (DVP) blends SEZ’s proven, high-volume Da Vinci technology with some of its newest capabilities—from the Esanti system—in a flexible, dual-use (BEOL and FEOL), single-wafer wet processing platform. This advanced tool is set to address the increasing device complexities and process requirements that have begun to create an overlap of BEOL and FEOL applications, particularly below 45 nm, as well as the emergence of a new genre of materials.

Built upon SEZ’s proven Spin Processor technology, the DVP features SEZ’s latest single-wafer processing advances. These include double-sided processing, Active-Jet technology for non-damage defect removal, SEZ’s proprietary Atmospheric Surface Drying (ASD) to minimize watermark formation and pattern collapse, and multi-chemical recirculation capabilities. Incorporated into SEZ’s flagship Da Vinci platform, these new features enable manufacturers to implement a best-of-breed wet processing solution with a very low overall cost of ownership. The DVP targets a mix of BEOL and FEOL applications, including polymer removal, bevel cleaning, high-k bevel clean, high-k wet etch, contact clean, pre-diffusion/gate clean and post-salicidation clean.

Key Benefits

• BEOL and FEOL Proven Single-Wafer technology
• Maximized Throughput
• Enhanced Surface Defect Removal
• Optimized Process Performance
• Simultaneous Double-Site Processing
• Multi-Chemical Recirculation
• Flexible Chemistry Application
• Reliable Process and Support
• Reduced Media Consumption
• Advanced Drying