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SEZ >  Press Room  >  Press Releases  >  Archives
Archives
31-Jan-02: First Double Sided Single Wafer Spin-Processor Available for Cleaning Applications    
 
05-Dec-01: Company Contact: Agency Contact:   
 
03-Dec-01: International SEMATECH Takes Delivery of SEZ Spin-Processor for 300 mm R&D   
 
26-Nov-01: SEZ Wins 300 mm Order from New Taiwanese Customer    
 
15-Oct-01: SEZ to Launch Global Wet Bench Business    
 
05-Sep-01: SEZ Opens New Service Center to Support Growing German Client Base   
 
16-Jul-01: SEZ Unveils New Wet/Dry Strategy, Five New 300 mm Orders and New Corporate Executive Board   
 
27-Jun-01: SEZ Receives First Order from Advanced Micro Devices   
 
19-Jun-01: Axcelis Teams with SEZ to Develop Dry/Wet Cleaning Processes   
 
13-Jun-01: SEZ Adds Chief Information Officer to Streamline IT Operations   
 
30-May-01: SEZ Completes Takeover of Japanese Joint Venture    
 
08-May-01: SEZ America Adds Research, Development and Engineering Team   
 
24-Apr-01: SEZ Announces Joint Development Agreement with Pure Wafer to Develop Single Wafer 300 mm Cleaning    
 
6-Apr-01: SEZ Receives Multiple 300 mm System Order from New Customer    
 
28-Mar-01: Three New 300 mm Products Reinforce SEZ's Leadership in Wafer Surface Preparation    
 
14-Mar-01: SEZ Group Exceeds Sales and Profit Expectations for 2000   
 
22-Feb-01: SEZ Expands Semiconductor Wet Processing Portfolio with Acquisition of Wet Bench Supplier HMR   
 
29-Jan-01: SEZ Opens Taiwan Subsidiary to Support Strong Regional Demand for Spin-Process    
 
24-Jan-01: SEZ Wins Multiple 300 mm Orders   
 
13-Dec-00: Semiconductor Applications Development Lab Using SEZ Spin-Processing    
 
06-Dec-00: SEZ and Disco Produce World's Thinnest 300 mm Wafer   
 
04-Dec-00: SEZ Opens First Korean Office    
 
27-Nov-00: Multiple Order for SEZ Spin-Processor 4200 Received from Major Taiwanese Foundry    
 
02-Nov-00: SEZ America Promotes Jim Mello to Vice President of Operations    
 
12-Oct-00: SEZ Group Forecasts Higher Sales and Profits for 2000 and 2001    
 
19-Sep-00 SEZ Introduces New Generation Spin-Processor for 4-6" Wafer Fabrication   
 
22-Aug-00: Susan Jones Named Chief Operating Officer of SEZ America   
 
10-Jul-00: SEZ Achieves Production Ready Thinning of 300 mm Wafers to 100 Microns    
 
05-Jul-00: SEZ Continues Global Expansion with Launch of SEZ Japan   
 
27-Jun-00: Chip Equipment Maker SEZ Doubles Sales Forecast for 2000   
 
21-Jun-00: SEZ Delivers 50th Tool to Taiwan   
 
23-May-00: SEZ Expands Global Presence with New Singapore Office   
 
11-May-00: Spin-Processing Selected as Industry Mainstream for 300 mm Chip Making    
 
02-May-00: SEZ Offers First Double Sided Single-Wafer Spin-Processor    
 
20-Apr-00: SEZ Named Top Tier Supplier for 1999 by Semiconductor 300   
 
17-Apr-00: SEZ Announces Partnership with Semiconductor300 to Develop 300 mm Production Capability    
 
03-Apr-00: SEZ and Ashland Forge Strategic Alliance Targeting Polymer Removal   
 
28-Mar-00: SEZ Unveils First Spin-Processor Compliant to SEMI Standards for 300 mm   
 
14-Mar-00: SEZ Appoints Global Vice President of New Business Development   
 
29-Feb-00: SEZ Increases Stepper and Scanner Yields With Innovative SpCE Process   
 
12-Jan-00: SEZ Sells First Spin-Processor 4200   
 
 

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