First Double Sided Single Wafer Spin-Processor Available for Cleaning Applications

The SEZ Group launched its newest Spin-Processor, the 8200, signaling the company's entry into the mass market for front end of line (FEOL) critical pre-cleaning applications. The Spin-Processor 8200 is the first non-contact, single wafer, double sided cleaner available on the market that meets the requirements of next generation technology nodes. With a throughput of up to 200 wafers per hour, the tool offers the proven process capabilities of SEZ Spin-Processing, an alternative to conventional cleaning technologies. The tool has completed production worthiness evaluation and is now available for shipment. This is SEZ's first pure cleaning tool and gives the company entry into the over $1 billion market for wet cleaning systems.

A four-chamber tool, the 8200 is based on the company's Spin-Processor 4200, with an incorporated double sided cleaning system. A single wafer tool, the Spin-Processor 8200 is capable of immediate uniform coverage of the wafer and better end uniformity while using less chemistry than other systems performing pre-diffusion cleans. The tool also eliminates redeposition and cross-contamination because chemicals are spun off the wafer surface and the wafers are not touched during transport. Additionally, the system offers the same or better throughput than batch processing eliminating water marks and residue contamination.

SEZ has an extensive global network of service and support capabilities to support its installed tools worldwide and will be especially valuable as SEZ enters the mass market. With local operations around the globe, SEZ offers extensive training programs for its customers. Last year's VLSI Research survey of small suppliers of wafer processing equipment ranked SEZ first in support after sales and fourth overall. Finally, a recent expansion at the company's headquarters in Villach, Austria doubled its production capacity ensuring the company's ability to deliver.

The SEZ Group has succeeded in establishing its unrivalled spin process technology as a world industry standard. Pioneered by the Group, this wet-etching process is
used for wafer surface preparation in the production of microchips. For further information please visit the SEZ website www.sez.com.
 
Upcoming:

March 14, 2001	Release of Key Figures 2000
April 18, 2001	Presentation of Financial Results, Zurich
May 10, 2001	Annual Shareholders' Meeting, Zurich

 
Zurich /Villach, January 31, 2001.