SEZ Receives Multiple 300 mm System Order from New Customer in the United States

The SEZ Group (SWX: SEZN) announced that it has received a multiple order for its Spin-Processors that are used for the treatment of 300 mm wafers. The order has a value of CHF 5.8 million [€ 3.8 million]. This completely new customer has placed its first ever order with SEZ for Spin-Processing equipment. The customer will use the SEZ systems for removal of backside contamination (copper, films, particles) in its 300 mm pilot line. Delivery is expected by the end of the second quarter of 2001.

The first order from this new, globally active customer emphasizes the leading international position of the SEZ Group with its unrivalled Spin-Process technology, especially in the demanding field of wafers with a 300 mm diameter. The Spin-Processor 304 performs many applications, including backside film removal prior to advanced lithography operations and silicon stress relief for die strength enhancement in thinning operations. Additional processes offered include backside contamination removal of copper and metallic, organic and other particles, frontside film thinning for critical operations, bevel cleaning and post-etch residue (polymer) removal.

The SEZ Group is a leading supplier of wet wafer surface preparation equipment to the global semiconductor manufacturing industry. The company's breakthrough proprietary Spin-Processor technology forms the basis of a broad portfolio of single wafer backside and frontside wafer surface conditioning products for semiconductor chipmakers worldwide. Additionally, the company offers a complete range of wet bench equipment for batch processing. SEZ maintains development, manufacturing, sales, marketing and service operations in Europe, Asia and North America. Registered in Zurich, Switzerland, SEZ Holding AG is listed on the Swiss Exchange under the symbol (SWX: SEZN). SEZ also can be found on the world wide web at www.sez.com.